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CROSSMOS is
an independent CMOS design center
- CROSSMOS
was created in 1982 and has gained since then a wide experience
in CMOS design and production
- CROSSMOS
works together with European manufacturing companies, all second
sourced
- CROSSMOS
has a minimum overhead and ensures therefore flexibility, versatility
and lowest costs
Founder and
owner: Walter
Hammer, *1943, MS degree from the Federal Institute of Technology
of Lausanne. Starting design in 1968, he has specialized since
1980 in semi-custom, and has developed together with his team
approximately 300 CMOS IC's. He is now a designer and the manager
of Mic-El-Enges Sàrl in Enges (near Neuchâtel in Switzerland),
and speaks fluent English, German, Swiss-German and French.
Crossmos sàrl is a member of the APTE Association
Mr. Walter Hammer Managing director is a member of the
APTE association
Find out more about the company's specialties and methods here.
http://www.apte.ch/crossmos
On March 19, 2003, CROSSMOS
celebrated its 20th
Anniversary. Please find selected statistics about
CROSSMOSS during the period from 1982 to 2002 [PDF
documents]:
CROSSMOS
Sàrl
Gare 15b
CH-2074 Marin
Switzerland
Tel.: 032 753 62 72
Fax: 032 753 61 09
Intl. tel.: +41 32 753 62 72
Intl. fax: +41 32 753 61 09
E-mail: crossmos@com.mcnet.ch
Website: http://www.apte.ch/crossmos
2.
THE SPECIALTIES
GATE-ARRAYS
TECHNOLOGY
- METAL-GATE
- 5 MHz at
5V
- High noise
immunity
- Ideal for
industrial environment
VOLTAGE RANGE
- Down to
0.9V
- Well suited
for battery operation
- Up to 18V
- Very low
power consumption
MIXED
ANALOG & DIGITAL LOW COMPLEXITY
All CROSSMOS
circuits allow one to mix analog and digital parts; the smallest
of these arrays can contain up to 15 gates, and the largest up
to 1530 gates. These chips are suitable for a new range of industrial,
automotive, medical and portable applications.
| FAST
TURN-AROUND |
LOW
COSTS |
| 4
to 10 weeks for samples |
CHF
8'000 to 35'000
(USD 12'000 to 50'000)
for the development
|
8
to 12 weeks
for production quantities |
down
to CHF 1.00/pce
(USD 0.70/pce)
for production quantities |
RESPONSIBILITY
OF THE DESIGN
CROSSMOS takes
full responsibility for the design and guarantees that the IC
will meet your specifications.
CUSTOMER
SUPPORT ALL THE TIME
It´s a pleasure
for us to help our customers solve any problems that may arise
between development and productions... or subsequently
3.
THE METHOD
- The goal
is to develop the customer's new circuit successfully, in close
cooperation with him and as quickly as possible...
- ... then
to produce it to a high standard in quality and to deliver it
on time
- Together
with a CROSSMOS engineer, you will quickly be able to define the
exact specifications for your circuit
- You will
receive a free quotation
- 50% of the
development cost is due on ordering
- CROSSMOS
will prepare the final schematic. You have to check it and give
your agreement
- The layout
drawing, mask and wafer manufacturing are under our responsibility,
and you have to test the first samples
- If they meet
specifications, the balance of the development cost is due
- If they don't
meet the specifications, we must be notified with a list of corrections
and/or modifications. CROSSMOS will start the redesign
- If a specification
change is requested during or after the development, thiswill
usually be made without additional cost
- Then, your
order for production is welcome
- The manufacturing,
packaging and testing are all under our responsibility
- For large
quantities we suggest a full-custom redesign in order to reduce
the IC price
- And CROSSMOS
wishes you much success in selling your updated product !
CMOS
- COMPONENT ARRAY MD 100
DESCRIPTION
The MD 100
is a semicustom masterchip built in a single metal CMOS-technology.
The main application
of this component array is to realize mixed-signal ASICs (Application
Specific integrated Circuits) of moderate complexity in a rather
short development time and with low development costs. The chip
contains a lot of different active and passive components which
can be interconnected by a single customized metal mask. The larger
part of the MD 100 has a gate array structure which is mainly
used for digital circuits. In addition to the gate array part,
it contains an analog section with transistors of different sizes,
diodes, resistors and capacitors. This part can be used to realize
numerous analog functions. The available components and the low
threshold voltage of the employed CMOS-process make the MD 100
specially suited to build low current and low voltage circuits.
CMOS
- COMPONENT ARRAY MD 200
DESRIPTION
The MD200
is a semicustom masterchip built in a single metal CMOS technology.
It employs
the same layout principles and the same technology as the MD 100.
The components of the MD200 are chosen to achieve optimum designs
for clocks and timing circuits. Compared to the MD100 it has a
much larger digital part (1530 instead of 696 gates), but a reduced
analog section and only 16 (instead of 28) input/output cells.
Despite the enlarged digital part it was possible to maintain
a small chip size (1.7mm x 2.5mm), which allows an assembly in
miniature SMD-packages (SO8 to SO16).
In the design concept of the MD200 there is no basic difference
between the cells which are primarily intended for digital functions
and the cells which are more suited for special (analog) functions.
Analog functions can be realized with "digital" cells
and the special ("analog") cells can be used to implement
digital functions. The special cells on one side of the
chip are optimized for the design of a low power crystal oscillator
together with a few stages of low power frequency dividers. The
special cells on the opposite side of the chip are mainly intended
as drivers to achieve a low output impedance for stepping
motors. In addition to the transistor cells, the MD200 contains
high-ohmic resistors, floating capacitors and diodes to implement
various analog functions.
The type of
available components and the low threshold voltage of the employed
CMOS process make the MD200 (as the MD100) specially suited to
build low current and low voltage circuits. The small chip
size is an important advantage for the miniaturization of modules
(sensors, watches, implanted electronics, etc.)
The semicustom
design approach of the MICRODUL MD-family results in considerably
reduced development costs and also lower production costs for
small and medium quantities compared to a full ASIC design.
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